FI-XB30SRL-HF11 - CONN RCPT 30P 0.039 GOLD SMD R/A
Manufacturer Part Number
Internal Part Number
Manufacturer
Brief Description
CONN RCPT 30P 0.039 GOLD SMD R/A
RoHS Status
Lead free / RoHS Compliant
Delivery Time
1-2 days
Available Quantity
61815 Pieces
Reference Price
Our Price
- (Please contact us for a better price: [email protected])
- AX Semiconductor have FI-XB30SRL-HF11 in stock for sell. We can ship to you within 1-2 days. Please contact us for a better price for FI-XB30SRL-HF11. Our email: [email protected]
- Shipping options and shipping time:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Payment Options:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
Specifications for FI-XB30SRL-HF11
Quality Guarantee : 365 days warranty
Stock Resource : Franchised Distributor / Manufacturer Direct
Country of Origin : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Part Number : FI-XB30SRL-HF11
Manufacturer : JAE Electronics
Description : CONN RCPT 30P 0.039 GOLD SMD R/A
Series : FI-X
Part Status : Obsolete
Connector Type : Receptacle
Contact Type : Non-Gendered
Style : Board to Cable/Wire
Number of Positions : 30
Number of Positions Loaded : All
Pitch - Mating : 0.039" (1.00mm)
Number of Rows : 1
Row Spacing - Mating : -
Mounting Type : Board Cutout, Bottom Mount, Surface Mount, Right Angle, Reverse Mount
Termination : Solder
Fastening Type : Friction Lock
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 12.0µin (0.30µm)
Insulation Color : Black
Insulation Height : -
Contact Length - Post : -
Operating Temperature : -40°C ~ 80°C
Material Flammability Rating : UL94 V-0
Contact Finish - Post : Tin
Mated Stacking Heights : -
Ingress Protection : -
Features : Grounding Pins, Shielded, Solder Retention
Current Rating : 1A per Contact
Voltage Rating : 200V
Weight : -
Condition : New and original
Documents for FI-XB30SRL-HF11
Datasheets : FI-XB30SRL-HF11.pdf
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