558-10-360M19-001104 - BGA SURFACE MOUNT 1.27MM
Manufacturer Part Number
Internal Part Number
Manufacturer
Brief Description
BGA SURFACE MOUNT 1.27MM
RoHS Status
Lead free / RoHS Compliant
Delivery Time
1-2 days
Available Quantity
6496 Pieces
Reference Price
Our Price
- (Please contact us for a better price: [email protected])
- AX Semiconductor have 558-10-360M19-001104 in stock for sell. We can ship to you within 1-2 days. Please contact us for a better price for 558-10-360M19-001104. Our email: [email protected]
- Shipping options and shipping time:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Payment Options:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
Specifications for 558-10-360M19-001104
Quality Guarantee : 365 days warranty
Stock Resource : Franchised Distributor / Manufacturer Direct
Country of Origin : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Part Number : 558-10-360M19-001104
Manufacturer : Preci-Dip
Description : BGA SURFACE MOUNT 1.27MM
Series : 558
Part Status : Active
Type : BGA
Number of Positions or Pins (Grid) : 360 (19 x 19)
Pitch - Mating : 0.050" (1.27mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Brass
Mounting Type : Surface Mount
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.050" (1.27mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Brass
Housing Material : FR4 Epoxy Glass
Operating Temperature : -55°C ~ 125°C
Weight : -
Condition : New and original
Related Links : 558-10 , 558-10-360
Documents for 558-10-360M19-001104
Datasheets : 558-10-360M19-001104.pdf
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