BDN10-3CB/A01 - HEATSINK CPU W/ADHESIVE 1.01SQ

Manufacturer Part Number

BDN10-3CB/A01

Internal Part Number

AX-BDN10-3CB/A01

Manufacturer

CTS Thermal Management Products

Brief Description

HEATSINK CPU W/ADHESIVE 1.01SQ

RoHS Status

Lead free / RoHS Compliant

Delivery Time

1-2 days

Available Quantity

177790 Pieces

Reference Price

~~USD 1.578~~

Our Price

- (Please contact us for a better price: [email protected])

AX Semiconductor have BDN10-3CB/A01 in stock for sell. We can ship to you within 1-2 days. Please contact us for a better price for BDN10-3CB/A01. Our email: [email protected]

Shipping options and shipping time:: DHL: 2-3 days.; FEDEX: 2-3 days.; UPS: 2-4 days.; TNT: 3-5 days.; EMS: 5-8 days.; Normal Post: 10-15 days.

Payment Options:: Paypal (Credit Card); Bank Transfer (Wire Transfer); Western Union; MoneyGram

Specifications for BDN10-3CB/A01

Quality Guarantee : 365 days warranty

Stock Resource : Franchised Distributor / Manufacturer Direct

Country of Origin : USA / TAIWAN / MEXICO / MALAYSIA / PHI

Part Number : BDN10-3CB/A01

Manufacturer : CTS Thermal Management Products

Description : HEATSINK CPU W/ADHESIVE 1.01SQ

Series : BDN

Part Status : Active

Type : Top Mount

Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)

Attachment Method : Thermal Tape, Adhesive (Included)

Shape : Square, Pin Fins

Length : 1.010" (25.65mm)

Width : 1.010" (25.65mm)

Diameter : -

Height Off Base (Height of Fin) : 0.355" (9.02mm)

Power Dissipation @ Temperature Rise : -

Thermal Resistance @ Forced Air Flow : 8.00°C/W @ 400 LFM

Thermal Resistance @ Natural : 26.40°C/W

Material : Aluminum

Material Finish : Black Anodized

Weight : -

Condition : New and original

Documents for BDN10-3CB/A01

Datasheets : BDN10-3CB/A01.pdf

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