APF19-19-06CB - HEATSINK LOW-PROFILE FORGED
Manufacturer Part Number
Internal Part Number
Manufacturer
Brief Description
HEATSINK LOW-PROFILE FORGED
RoHS Status
Lead free / RoHS Compliant
Delivery Time
1-2 days
Available Quantity
96210 Pieces
Reference Price
Our Price
- (Please contact us for a better price: [email protected])
- AX Semiconductor have APF19-19-06CB in stock for sell. We can ship to you within 1-2 days. Please contact us for a better price for APF19-19-06CB. Our email: [email protected]
- Shipping options and shipping time:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Payment Options:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
Specifications for APF19-19-06CB
Quality Guarantee : 365 days warranty
Stock Resource : Franchised Distributor / Manufacturer Direct
Country of Origin : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Part Number : APF19-19-06CB
Manufacturer : CTS Thermal Management Products
Description : HEATSINK LOW-PROFILE FORGED
Series : APF
Part Status : Active
Type : Top Mount
Package Cooled : Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method : Thermal Tape, Adhesive (Not Included)
Shape : Square, Fins
Length : 0.748" (19.00mm)
Width : 0.748" (19.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.250" (6.35mm)
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : 7.10°C/W @ 200 LFM
Thermal Resistance @ Natural : -
Material : Aluminum
Material Finish : Black Anodized
Weight : -
Condition : New and original
Documents for APF19-19-06CB
Datasheets : APF19-19-06CB.pdf
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