EPC2100ENG - GAN TRANS 2N-CH 30V BUMPED DIE
Manufacturer Part Number
Internal Part Number
AX-EPC2100ENG
Manufacturer
Brief Description
GAN TRANS 2N-CH 30V BUMPED DIE
RoHS Status
Lead free / RoHS Compliant
Delivery Time
1-2 days
Available Quantity
28476 Pieces
Reference Price
Our Price
- (Please contact us for a better price: [email protected])
- AX Semiconductor have EPC2100ENG in stock for sell. We can ship to you within 1-2 days. Please contact us for a better price for EPC2100ENG. Our email: [email protected]
- Shipping options and shipping time:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Payment Options:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
Specifications for EPC2100ENG
Quality Guarantee : 365 days warranty
Stock Resource : Franchised Distributor / Manufacturer Direct
Country of Origin : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Part Number : EPC2100ENG
Manufacturer : EPC
Description : GAN TRANS 2N-CH 30V BUMPED DIE
Series : eGaN®
Part Status : Discontinued at Digi-Key
FET Type : 2 N-Channel (Half Bridge)
FET Feature : GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss) : 30V
Current - Continuous Drain (Id) @ 25°C : 10A (Ta), 40A (Ta)
Rds On (Max) @ Id, Vgs : 8.2 mOhm @ 25A, 5V, 2.1 mOhm @ 25A, 5V
Vgs(th) (Max) @ Id : 2.5V @ 4mA, 2.5V @ 16mA
Gate Charge (Qg) (Max) @ Vgs : 4.9nC @ 15V, 19nC @ 15V
Input Capacitance (Ciss) (Max) @ Vds : 475pF @ 15V, 1960pF @ 15V
Power - Max : -
Operating Temperature : -40°C ~ 150°C (TJ)
Mounting Type : Surface Mount
Package / Case : Die
Supplier Device Package : Die
Weight : -
Condition : New and original
Documents for EPC2100ENG
Datasheets : EPC2100ENG.pdf
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