TI900-105-27-0.12-1A Datasheet
Specifications for TI900-105-27-0.12-1A
Part Number : TI900-105-27-0.12-1A
Manufacturer : t-Global Technology
Description : THERM PAD 105MMX27MM W/ADH WHITE
Series : Ti900
Part Status : Active
Usage : -
Type : Conductive Insulator Pad
Shape : Rectangular
Outline : 105.00mm x 27.00mm
Thickness : 0.0050" (0.127mm)
Material : Silicone
Adhesive : Adhesive - One Side
Backing, Carrier : Viscose
Color : White
Thermal Resistivity : -
Thermal Conductivity : 1.8 W/m-K
Weight : -
Condition : New and original
Quality Guarantee : 365 days warranty
Stock Resource : Franchised Distributor / Manufacturer Direct
Country of Origin : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Manufacturer Part Number
Internal Part Number
Manufacturer
Brief Description
THERM PAD 105MMX27MM W/ADH WHITE
RoHS Status
Lead free / RoHS Compliant
Delivery Time
1-2 days
Available Quantity
358315 Pieces
Reference Price
Our Price
- (Please contact us for a better price: [email protected])
- AX Semiconductor have TI900-105-27-0.12-1A in stock for sell. We can ship to you within 1-2 days. Please contact us for a better price for TI900-105-27-0.12-1A. Our email: [email protected]
- Shipping options and shipping time:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Payment Options:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
Related products for TI900-105-27-0.12-1A t-Global Technology
| Part Number | Brand | Description | Buy |
|---|---|---|---|
| Intel | IC CPLD 1700MC 7NS 324FBGA | ||
| Intel | IC CPLD 980MC 6.2NS 256FBGA | ||
| Xilinx Inc. | IC CPLD 512MC 9.2NS 256FTBGA | ||
| Intel | IC CPLD 256MC 5.5NS 100FBGA | ||
| Xilinx Inc. | IC CPLD 512MC 7.1NS 256BGA | ||
| Intel | IC CPLD 512MC 10NS 256FBGA | ||
| Xilinx Inc. | IC CPLD 384MC 9NS 144QFP | ||
| Intel | IC CPLD 64MC 10NS 100FBGA | ||
| Lattice Semiconductor Corporation | IC CPLD 512MC 3.5NS 176TQFP | ||
| Intel | IC CPLD 128MC 7.5NS 100FBGA |