THINC23-TO220-21.5-11.4-5.8-0.45 Datasheet
Specifications for THINC23-TO220-21.5-11.4-5.8-0.45
Part Number : THINC23-TO220-21.5-11.4-5.8-0.45
Manufacturer : t-Global Technology
Description : THERM PAD 21.5MMX11.4MMX5.8MM
Series : THINC
Part Status : Active
Usage : TO-220
Type : Interface Cap
Shape : Rectangular
Outline : 21.50mm x 11.40mm x 5.80mm
Thickness : 0.0177" (0.450mm)
Material : Silicone
Adhesive : -
Backing, Carrier : -
Color : Gray
Thermal Resistivity : -
Thermal Conductivity : 1.9 W/m-K
Weight : -
Condition : New and original
Quality Guarantee : 365 days warranty
Stock Resource : Franchised Distributor / Manufacturer Direct
Country of Origin : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Manufacturer Part Number
Internal Part Number
Manufacturer
Brief Description
THERM PAD 21.5MMX11.4MMX5.8MM
RoHS Status
Lead free / RoHS Compliant
Delivery Time
1-2 days
Available Quantity
1416985 Pieces
Reference Price
Our Price
- (Please contact us for a better price: [email protected])
- AX Semiconductor have THINC23-TO220-21.5-11.4-5.8-0.45 in stock for sell. We can ship to you within 1-2 days. Please contact us for a better price for THINC23-TO220-21.5-11.4-5.8-0.45. Our email: [email protected]
- Shipping options and shipping time:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Payment Options:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
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