TGF30SF-07870787-059 Datasheet
Specifications for TGF30SF-07870787-059
Part Number : TGF30SF-07870787-059
Manufacturer : Leader Tech Inc.
Description : THERM PAD 199.9MMX199.9MM GRAY
Series : TGF30SF
Part Status : Active
Usage : -
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 199.90mm x 199.90mm
Thickness : 0.0591" (1.500mm)
Material : Aluminum Oxide filled Acrylic
Adhesive : -
Backing, Carrier : -
Color : Gray
Thermal Resistivity : 0.60°C/W
Thermal Conductivity : 3.0 W/m-K
Weight : -
Condition : New and original
Quality Guarantee : 365 days warranty
Stock Resource : Franchised Distributor / Manufacturer Direct
Country of Origin : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Manufacturer Part Number
Internal Part Number
Manufacturer
Brief Description
THERM PAD 199.9MMX199.9MM GRAY
RoHS Status
Lead free / RoHS Compliant
Delivery Time
1-2 days
Available Quantity
21077 Pieces
Reference Price
Our Price
- (Please contact us for a better price: [email protected])
- AX Semiconductor have TGF30SF-07870787-059 in stock for sell. We can ship to you within 1-2 days. Please contact us for a better price for TGF30SF-07870787-059. Our email: [email protected]
- Shipping options and shipping time:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Payment Options:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
Related products for TGF30SF-07870787-059 Leader Tech Inc.
| Part Number | Brand | Description | Buy |
|---|---|---|---|
| Xilinx Inc. | IC CPLD 384MC 7.1NS 256BGA | ||
| Xilinx Inc. | IC CPLD 384MC 9NS 208QFP | ||
| Intel | IC CPLD 64MC 15NS 100QFP | ||
| Intel | IC CPLD 512MC 7.5NS 256FBGA | ||
| Xilinx Inc. | IC CPLD 384MC 10.8NS 256BGA | ||
| Lattice Semiconductor Corporation | IC CPLD 384MC 5NS 176TQFP | ||
| Xilinx Inc. | IC CPLD 512MC 9.2NS 208QFP | ||
| Intel | IC CPLD 512MC 7.5NS 208QFP | ||
| Intel | IC CPLD 256MC 10NS 208QFP | ||
| Intel | IC CPLD 256MC 7.5NS 208QFP |