SP900S-0.009-AC-54 Datasheet
Specifications for SP900S-0.009-AC-54
Part Number : SP900S-0.009-AC-54
Manufacturer : Bergquist
Description : THERM PAD 19.05MMX12.7MM W/ADH
Series : Sil-Pad® 900-S
Part Status : Active
Usage : TO-220
Type : Pad, Sheet
Shape : Rectangular
Outline : 19.05mm x 12.70mm
Thickness : 0.0090" (0.229mm)
Material : Silicone Rubber
Adhesive : Adhesive - One Side
Backing, Carrier : Fiberglass
Color : Pink
Thermal Resistivity : 0.61°C/W
Thermal Conductivity : 1.6 W/m-K
Weight : -
Condition : New and original
Quality Guarantee : 365 days warranty
Stock Resource : Franchised Distributor / Manufacturer Direct
Country of Origin : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Manufacturer Part Number
Internal Part Number
Manufacturer
Brief Description
THERM PAD 19.05MMX12.7MM W/ADH
RoHS Status
Lead free / RoHS Compliant
Delivery Time
1-2 days
Available Quantity
2338030 Pieces
Reference Price
Our Price
- (Please contact us for a better price: [email protected])
- AX Semiconductor have SP900S-0.009-AC-54 in stock for sell. We can ship to you within 1-2 days. Please contact us for a better price for SP900S-0.009-AC-54. Our email: [email protected]
- Shipping options and shipping time:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Payment Options:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
Related products for SP900S-0.009-AC-54 Bergquist
| Part Number | Brand | Description | Buy |
|---|---|---|---|
| Intel | IC CPLD 64MC 7.5NS 44TQFP | ||
| Xilinx Inc. | IC CPLD 512MC 9.2NS 324BGA | ||
| Xilinx Inc. | IC CPLD 384MC 7.1NS 324FBGA | ||
| Intel | IC CPLD 980MC 6.2NS 256FBGA | ||
| Xilinx Inc. | IC CPLD 512MC 7.1NS 256BGA | ||
| Lattice Semiconductor Corporation | IC CPLD 512MC 5NS 176TQFP | ||
| Xilinx Inc. | IC CPLD 512MC 10.8NS 256BGA | ||
| Intel | IC CPLD 512MC 7.5NS 256FBGA | ||
| Xilinx Inc. | IC CPLD 384MC 7.1NS 208QFP | ||
| Lattice Semiconductor Corporation | IC CPLD 512MC 3.5NS 256FTBGA |