SP2000-0.015-00-24 Datasheet
Specifications for SP2000-0.015-00-24
Part Number : SP2000-0.015-00-24
Manufacturer : Bergquist
Description : THERM PAD 43.18MMX30.15MM WHITE
Series : Sil-Pad® 2000
Part Status : Active
Usage : TO-220
Type : Insulator Pad, Sheet
Shape : Rhombus
Outline : 43.18mm x 30.15mm
Thickness : 0.0150" (0.381mm)
Material : Silicone Elastomer
Adhesive : -
Backing, Carrier : Fiberglass
Color : White
Thermal Resistivity : -
Thermal Conductivity : 3.5 W/m-K
Weight : -
Condition : New and original
Quality Guarantee : 365 days warranty
Stock Resource : Franchised Distributor / Manufacturer Direct
Country of Origin : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Manufacturer Part Number
Internal Part Number
Manufacturer
Brief Description
THERM PAD 43.18MMX30.15MM WHITE
RoHS Status
Lead free / RoHS Compliant
Delivery Time
1-2 days
Available Quantity
240285 Pieces
Reference Price
Our Price
- (Please contact us for a better price: [email protected])
- AX Semiconductor have SP2000-0.015-00-24 in stock for sell. We can ship to you within 1-2 days. Please contact us for a better price for SP2000-0.015-00-24. Our email: [email protected]
- Shipping options and shipping time:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Payment Options:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
Related products for SP2000-0.015-00-24 Bergquist
| Part Number | Brand | Description | Buy |
|---|---|---|---|
| Xilinx Inc. | IC CPLD 384MC 10.8NS 144QFP | ||
| Intel | IC CPLD 256MC 7.5NS 100TQFP | ||
| Cypress Semiconductor Corp | IC CPLD 32MC 10NS 44LQFP | ||
| Intel | IC CPLD 1700MC 7NS 324FBGA | ||
| Intel | IC CPLD 256MC 7.5NS 100TQFP | ||
| Intel | IC CPLD 64MC 7.5NS 44TQFP | ||
| Lattice Semiconductor Corporation | IC CPLD 256MC 7.5NS 272BGA | ||
| Microchip Technology | IC CPLD 24MC 20NS 44JLCC | ||
| Intel | IC CPLD 256MC 7.5NS 208QFP | ||
| Intel | IC CPLD 512MC 7.5NS 144TQFP |