L37-3-10-10-0.3 Datasheet
Specifications for L37-3-10-10-0.3
Part Number : L37-3-10-10-0.3
Manufacturer : t-Global Technology
Description : THERM PAD 10MMX10MM YELLOW
Series : L37-3
Part Status : Active
Usage : -
Type : Conductive Pad, Sheet
Shape : Square
Outline : 10.00mm x 10.00mm
Thickness : 0.0120" (0.305mm)
Material : Silicone Elastomer
Adhesive : -
Backing, Carrier : Fiberglass
Color : Yellow
Thermal Resistivity : -
Thermal Conductivity : 1.7 W/m-K
Weight : -
Condition : New and original
Quality Guarantee : 365 days warranty
Stock Resource : Franchised Distributor / Manufacturer Direct
Country of Origin : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Manufacturer Part Number
Internal Part Number
Manufacturer
Brief Description
THERM PAD 10MMX10MM YELLOW
RoHS Status
Lead free / RoHS Compliant
Delivery Time
1-2 days
Available Quantity
4676065 Pieces
Reference Price
Our Price
- (Please contact us for a better price: [email protected])
- AX Semiconductor have L37-3-10-10-0.3 in stock for sell. We can ship to you within 1-2 days. Please contact us for a better price for L37-3-10-10-0.3. Our email: [email protected]
- Shipping options and shipping time:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Payment Options:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
Related products for L37-3-10-10-0.3 t-Global Technology
| Part Number | Brand | Description | Buy |
|---|---|---|---|
| Intel | IC CPLD 512MC 10NS 208QFP | ||
| Intel | IC CPLD 128MC 5NS 144TQFP | ||
| Lattice Semiconductor Corporation | IC CPLD 256MC 10NS 208QFP | ||
| Intel | IC CPLD 1700MC 7NS 324FBGA | ||
| Xilinx Inc. | IC CPLD 384MC 10.8NS 256BGA | ||
| Xilinx Inc. | IC CPLD 512MC 9.2NS 256BGA | ||
| Xilinx Inc. | IC CPLD 384MC 7NS 208QFP | ||
| Lattice Semiconductor Corporation | IC CPLD 512MC 10NS 256FBGA | ||
| Intel | IC CPLD 256MC 10NS 208QFP | ||
| Intel | IC CPLD 256MC 7.5NS 208QFP |