Specifications for ED18DT

Part Number : ED18DT
Manufacturer : On Shore Technology Inc.
Description : CONN IC DIP SOCKET 18POS TIN
Series : ED
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 18 (2 x 9)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Tin
Contact Finish Thickness - Mating : 60.0µin (1.52µm)
Contact Material - Mating : Phosphor Bronze
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 60.0µin (1.52µm)
Contact Material - Post : Phosphor Bronze
Housing Material : Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature : -55°C ~ 110°C
Weight : -
Condition : New and original
Quality Guarantee : 365 days warranty
Stock Resource : Franchised Distributor / Manufacturer Direct
Country of Origin : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Manufacturer Part Number
Internal Part Number
Brief Description
CONN IC DIP SOCKET 18POS TIN
RoHS Status
Lead free / RoHS Compliant
Delivery Time
1-2 days
Available Quantity
2033070 Pieces
Reference Price
USD 0
Our Price
- (Please contact us for a better price: [email protected])

AX Semiconductor have ED18DT in stock for sell. We can ship to you within 1-2 days. Please contact us for a better price for ED18DT. Our email: [email protected]
Shipping options and shipping time:
DHL: 2-3 days.
FEDEX: 2-3 days.
UPS: 2-4 days.
TNT: 3-5 days.
EMS: 5-8 days.
Normal Post: 10-15 days.
Payment Options:
Paypal (Credit Card)
Bank Transfer (Wire Transfer)
Western Union
MoneyGram

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