DIP318-011BLF Datasheet
Specifications for DIP318-011BLF
Part Number : DIP318-011BLF
Manufacturer : Amphenol ICC (FCI)
Description : CONN IC DIP SOCKET 18POS GOLD
Series : -
Part Status : Obsolete
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 18 (2 x 9)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0µin (5.08µm)
Contact Material - Post : Brass
Housing Material : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature : -
Weight : -
Condition : New and original
Quality Guarantee : 365 days warranty
Stock Resource : Franchised Distributor / Manufacturer Direct
Country of Origin : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Manufacturer Part Number
Internal Part Number
Manufacturer
Brief Description
CONN IC DIP SOCKET 18POS GOLD
RoHS Status
Lead free / RoHS Compliant
Delivery Time
1-2 days
Available Quantity
38871 Pieces
Reference Price
Our Price
- (Please contact us for a better price: [email protected])
- AX Semiconductor have DIP318-011BLF in stock for sell. We can ship to you within 1-2 days. Please contact us for a better price for DIP318-011BLF. Our email: [email protected]
- Shipping options and shipping time:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Payment Options:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
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