DC0001/08-TI900-0.12-2A Datasheet
Specifications for DC0001/08-TI900-0.12-2A
Part Number : DC0001/08-TI900-0.12-2A
Manufacturer : t-Global Technology
Description : THERM PAD 41.91MMX28.96MM W/ADH
Series : Ti900
Part Status : Active
Usage : TO-3
Type : Die-Cut Pad, Sheet
Shape : Rhombus
Outline : 41.91mm x 28.96mm
Thickness : 0.0050" (0.127mm)
Material : Silicone
Adhesive : Adhesive - Both Sides
Backing, Carrier : Viscose
Color : White
Thermal Resistivity : -
Thermal Conductivity : 1.8 W/m-K
Weight : -
Condition : New and original
Quality Guarantee : 365 days warranty
Stock Resource : Franchised Distributor / Manufacturer Direct
Country of Origin : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Manufacturer Part Number
Internal Part Number
Manufacturer
Brief Description
THERM PAD 41.91MMX28.96MM W/ADH
RoHS Status
Lead free / RoHS Compliant
Delivery Time
1-2 days
Available Quantity
195645 Pieces
Reference Price
Our Price
- (Please contact us for a better price: [email protected])
- AX Semiconductor have DC0001/08-TI900-0.12-2A in stock for sell. We can ship to you within 1-2 days. Please contact us for a better price for DC0001/08-TI900-0.12-2A. Our email: [email protected]
- Shipping options and shipping time:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Payment Options:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
Related products for DC0001/08-TI900-0.12-2A t-Global Technology
| Part Number | Brand | Description | Buy |
|---|---|---|---|
| Xilinx Inc. | IC CPLD 384MC 10.8NS 144QFP | ||
| Xilinx Inc. | IC CPLD 512MC 9NS 324BGA | ||
| Intel | IC CPLD 64MC 4.5NS 100FBGA | ||
| Lattice Semiconductor Corporation | IC CPLD 256MC 7.5NS 272BGA | ||
| Xilinx Inc. | IC CPLD 384MC 7.1NS 324FBGA | ||
| Intel | IC CPLD 1700MC 7NS 256FBGA | ||
| Xilinx Inc. | IC CPLD 512MC 10.8NS 208QFP | ||
| Xilinx Inc. | IC CPLD 512MC 10.8NS 324BGA | ||
| Xilinx Inc. | IC CPLD 512MC 9.2NS 324FBGA | ||
| Intel | IC CPLD 512MC 10NS 144TQFP |