CPU 1.375X1.375 Datasheet
Specifications for CPU 1.375X1.375
Part Number : CPU 1.375X1.375
Manufacturer : Bergquist
Description : THERM PAD 34.93MMX34.93MM TAN
Series : CPU Pad™
Part Status : Obsolete
Usage : CPU
Type : Pad, Sheet
Shape : Square
Outline : 34.93mm x 34.93mm
Thickness : 0.0050" (0.127mm)
Material : -
Adhesive : -
Backing, Carrier : -
Color : Tan
Thermal Resistivity : -
Thermal Conductivity : 0.6 W/m-K
Weight : -
Condition : New and original
Quality Guarantee : 365 days warranty
Stock Resource : Franchised Distributor / Manufacturer Direct
Country of Origin : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Manufacturer Part Number
Internal Part Number
Manufacturer
Brief Description
THERM PAD 34.93MMX34.93MM TAN
RoHS Status
Lead free / RoHS Compliant
Delivery Time
1-2 days
Available Quantity
43038 Pieces
Reference Price
Our Price
- (Please contact us for a better price: [email protected])
- AX Semiconductor have CPU 1.375X1.375 in stock for sell. We can ship to you within 1-2 days. Please contact us for a better price for CPU 1.375X1.375. Our email: [email protected]
- Shipping options and shipping time:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Payment Options:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
Related products for CPU 1.375X1.375 Bergquist
| Part Number | Brand | Description | Buy |
|---|---|---|---|
| Lattice Semiconductor Corporation | IC CPLD 384MC 15NS 160QFP | ||
| Intel | IC CPLD 256MC 7.5NS 100TQFP | ||
| Intel | IC CPLD 512MC 12NS 256FBGA | ||
| Intel | IC CPLD 128MC 5NS 100FBGA | ||
| Lattice Semiconductor Corporation | IC CPLD 512MC 10NS 256FBGA | ||
| Xilinx Inc. | IC CPLD 512MC 9NS 324BGA | ||
| Xilinx Inc. | IC CPLD 384MC 10.8NS 256BGA | ||
| Intel | IC CPLD 1700MC 7NS 256FBGA | ||
| Lattice Semiconductor Corporation | IC CPLD 64MC 15NS 44TQFP | ||
| Lattice Semiconductor Corporation | IC CPLD 512MC 5NS 176TQFP |