Specifications for COH-1016LVC-400-30-1NT

Part Number : COH-1016LVC-400-30-1NT
Manufacturer : Taica North America Corporation
Description : THERMAL INTERFACE PAD GAP PAD
Series : aGELâ„¢ COH
Part Status : Active
Usage : -
Type : Gel Pad, Sheet
Shape : Square
Outline : 400.00mm x 400.00mm
Thickness : 0.118" (3.00mm)
Material : Silicone Gel
Adhesive : Tacky - One Side
Backing, Carrier : -
Color : White
Thermal Resistivity : -
Thermal Conductivity : 1.9 W/m-K
Weight : -
Condition : New and original
Quality Guarantee : 365 days warranty
Stock Resource : Franchised Distributor / Manufacturer Direct
Country of Origin : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Manufacturer Part Number
Internal Part Number
Brief Description
THERMAL INTERFACE PAD GAP PAD
RoHS Status
Lead free / RoHS Compliant
Delivery Time
1-2 days
Available Quantity
5088 Pieces
Reference Price
USD 0
Our Price
- (Please contact us for a better price: [email protected])

AX Semiconductor have COH-1016LVC-400-30-1NT in stock for sell. We can ship to you within 1-2 days. Please contact us for a better price for COH-1016LVC-400-30-1NT. Our email: [email protected]
Shipping options and shipping time:
DHL: 2-3 days.
FEDEX: 2-3 days.
UPS: 2-4 days.
TNT: 3-5 days.
EMS: 5-8 days.
Normal Post: 10-15 days.
Payment Options:
Paypal (Credit Card)
Bank Transfer (Wire Transfer)
Western Union
MoneyGram

Related products for COH-1016LVC-400-30-1NT Taica North America Corporation

Part Number Brand Description Buy

EPM7512AETC144-7N

Intel

IC CPLD 512MC 7.5NS 144TQFP

XC2C384-10FG324I

Xilinx Inc.

IC CPLD 384MC 9.2NS 324FBGA

XCR3384XL-10TQG144I

Xilinx Inc.

IC CPLD 384MC 9NS 144QFP

EPM7064QC100-15MM

Intel

IC CPLD 64MC 15NS 100QFP

XCR3384XL-12FTG256C

Xilinx Inc.

IC CPLD 384MC 10.8NS 256BGA

EPM2210GF324C4

Intel

IC CPLD 1700MC 7NS 324FBGA

EPM1270GF256C3N

Intel

IC CPLD 980MC 6.2NS 256FBGA

EPM7512AEFC256-10N

Intel

IC CPLD 512MC 10NS 256FBGA

EPM7128STI100-10NG

Intel

IC CPLD 128MC 10NS 100TQFP

XC2C512-10FGG324C

Xilinx Inc.

IC CPLD 512MC 9.2NS 324BGA