A17820-13 Datasheet
Specifications for A17820-13
Part Number : A17820-13
Manufacturer : Laird Technologies - Thermal Materials
Description : TFLEX HD93250DC1
Series : Tflex™ HD90000
Part Status : Active
Usage : CPU
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 457.20mm x 457.20mm
Thickness : 0.130" (3.30mm)
Material : Silicone, Ceramic Filled
Adhesive : Tacky - One Side
Backing, Carrier : -
Color : Gray
Thermal Resistivity : -
Thermal Conductivity : 7.5 W/m-K
Weight : -
Condition : New and original
Quality Guarantee : 365 days warranty
Stock Resource : Franchised Distributor / Manufacturer Direct
Country of Origin : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Manufacturer Part Number
Internal Part Number
AX-A17820-13
Manufacturer
Brief Description
TFLEX HD93250DC1
RoHS Status
Lead free / RoHS Compliant
Delivery Time
1-2 days
Available Quantity
9222 Pieces
Reference Price
Our Price
- (Please contact us for a better price: [email protected])
- AX Semiconductor have A17820-13 in stock for sell. We can ship to you within 1-2 days. Please contact us for a better price for A17820-13. Our email: [email protected]
- Shipping options and shipping time:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Payment Options:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
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