Specifications for A17157-11

Part Number : A17157-11
Manufacturer : Laird Technologies - Thermal Materials
Description : THERM PAD 457.2MMX457.2MM PINK
Series : Tflex™ HD300
Part Status : Active
Usage : -
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 457.20mm x 457.20mm
Thickness : 0.110" (2.79mm)
Material : Silicone Elastomer
Adhesive : Tacky - One Side
Backing, Carrier : -
Color : Pink
Thermal Resistivity : -
Thermal Conductivity : 2.7 W/m-K
Weight : -
Condition : New and original
Quality Guarantee : 365 days warranty
Stock Resource : Franchised Distributor / Manufacturer Direct
Country of Origin : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Manufacturer Part Number
Internal Part Number
Brief Description
THERM PAD 457.2MMX457.2MM PINK
RoHS Status
Lead free / RoHS Compliant
Delivery Time
1-2 days
Available Quantity
9225 Pieces
Reference Price
USD 0
Our Price
- (Please contact us for a better price: [email protected])

AX Semiconductor have A17157-11 in stock for sell. We can ship to you within 1-2 days. Please contact us for a better price for A17157-11. Our email: [email protected]
Shipping options and shipping time:
DHL: 2-3 days.
FEDEX: 2-3 days.
UPS: 2-4 days.
TNT: 3-5 days.
EMS: 5-8 days.
Normal Post: 10-15 days.
Payment Options:
Paypal (Credit Card)
Bank Transfer (Wire Transfer)
Western Union
MoneyGram

Related products for A17157-11 Laird Technologies - Thermal Materials

Part Number Brand Description Buy

XC2C384-7PQG208C

Xilinx Inc.

IC CPLD 384MC 7.1NS 208QFP

XCR3512XL-10PQ208C

Xilinx Inc.

IC CPLD 512MC 9NS 208QFP

EPM7064AEFC100-4N

Intel

IC CPLD 64MC 4.5NS 100FBGA

EPM7256AETC144-7

Intel

IC CPLD 256MC 7.5NS 144TQFP

XCR3512XL-10FTG256C

Xilinx Inc.

IC CPLD 512MC 9NS 256BGA

XCR3384XL-12TQG144I

Xilinx Inc.

IC CPLD 384MC 10.8NS 144QFP

EPM7512AEFC256-7N

Intel

IC CPLD 512MC 7.5NS 256FBGA

EPM2210F324A5N

Intel

IC CPLD 1700MC 7NS 324FBGA

XC2C512-10FTG256C

Xilinx Inc.

IC CPLD 512MC 9.2NS 256FBGA

XCR3384XL-7PQG208C

Xilinx Inc.

IC CPLD 384MC 7NS 208QFP