Specifications for A15754-09

Part Number : A15754-09
Manufacturer : Laird Technologies - Thermal Materials
Description : TFLEX SF890
Series : Tflex™ SF800
Part Status : Active
Usage : -
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 228.60mm x 228.60mm
Thickness : 0.0900" (2.286mm)
Material : Non-Silicone
Adhesive : Tacky - Both Sides
Backing, Carrier : -
Color : Gray
Thermal Resistivity : 0.19°C/W
Thermal Conductivity : 7.8 W/m-K
Weight : -
Condition : New and original
Quality Guarantee : 365 days warranty
Stock Resource : Franchised Distributor / Manufacturer Direct
Country of Origin : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Manufacturer Part Number
Internal Part Number
Brief Description
TFLEX SF890
RoHS Status
Lead free / RoHS Compliant
Delivery Time
1-2 days
Available Quantity
9343 Pieces
Reference Price
USD 0
Our Price
- (Please contact us for a better price: [email protected])

AX Semiconductor have A15754-09 in stock for sell. We can ship to you within 1-2 days. Please contact us for a better price for A15754-09. Our email: [email protected]
Shipping options and shipping time:
DHL: 2-3 days.
FEDEX: 2-3 days.
UPS: 2-4 days.
TNT: 3-5 days.
EMS: 5-8 days.
Normal Post: 10-15 days.
Payment Options:
Paypal (Credit Card)
Bank Transfer (Wire Transfer)
Western Union
MoneyGram

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