A15335-02 Datasheet
Specifications for A15335-02
Part Number : A15335-02
Manufacturer : Laird Technologies - Thermal Materials
Description : TFLEX 3150
Series : Tflex™ 300
Part Status : Active
Usage : -
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 228.60mm x 228.60mm
Thickness : 0.0200" (0.508mm)
Material : Silicone Elastomer
Adhesive : -
Backing, Carrier : -
Color : Green
Thermal Resistivity : 2.11°C/W
Thermal Conductivity : 1.2 W/m-K
Weight : -
Condition : New and original
Quality Guarantee : 365 days warranty
Stock Resource : Franchised Distributor / Manufacturer Direct
Country of Origin : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Manufacturer Part Number
Internal Part Number
AX-A15335-02
Manufacturer
Brief Description
TFLEX 3150
RoHS Status
Lead free / RoHS Compliant
Delivery Time
1-2 days
Available Quantity
6040 Pieces
Reference Price
Our Price
- (Please contact us for a better price: [email protected])
- AX Semiconductor have A15335-02 in stock for sell. We can ship to you within 1-2 days. Please contact us for a better price for A15335-02. Our email: [email protected]
- Shipping options and shipping time:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Payment Options:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
Related products for A15335-02 Laird Technologies - Thermal Materials
| Part Number | Brand | Description | Buy |
|---|---|---|---|
| Lattice Semiconductor Corporation | IC CPLD 8MC 15NS 20PLCC | ||
| Intel | IC CPLD 1700MC 7NS 256FBGA | ||
| Intel | IC CPLD 128MC 10NS 100FBGA | ||
| Xilinx Inc. | IC CPLD 512MC 9NS 256BGA | ||
| Xilinx Inc. | IC CPLD 384MC 10.8NS 256BGA | ||
| Lattice Semiconductor Corporation | IC CPLD 96MC 5.5NS 100TQFP | ||
| Xilinx Inc. | IC CPLD 384MC 7.1NS 208QFP | ||
| Intel | IC CPLD 512MC 10NS 208QFP | ||
| Xilinx Inc. | IC CPLD 512MC 10.8NS 256BGA | ||
| Lattice Semiconductor Corporation | IC CPLD 512MC 3.5NS 176TQFP |