Specifications for A10097-20

Part Number : A10097-20
Manufacturer : Laird Technologies - Thermal Materials
Description : THERM PAD 406.4MMX406.4MM W/ADH
Series : Tpliā„¢ 200
Part Status : Active
Usage : -
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 406.40mm x 406.40mm
Thickness : 0.0500" (1.270mm)
Material : Silicone Elastomer
Adhesive : Adhesive - One Side
Backing, Carrier : -
Color : Yellow
Thermal Resistivity : -
Thermal Conductivity : 6.0 W/m-K
Weight : -
Condition : New and original
Quality Guarantee : 365 days warranty
Stock Resource : Franchised Distributor / Manufacturer Direct
Country of Origin : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Manufacturer Part Number
Internal Part Number
Brief Description
THERM PAD 406.4MMX406.4MM W/ADH
RoHS Status
Lead free / RoHS Compliant
Delivery Time
1-2 days
Available Quantity
9162 Pieces
Reference Price
USD 0
Our Price
- (Please contact us for a better price: [email protected])

AX Semiconductor have A10097-20 in stock for sell. We can ship to you within 1-2 days. Please contact us for a better price for A10097-20. Our email: [email protected]
Shipping options and shipping time:
DHL: 2-3 days.
FEDEX: 2-3 days.
UPS: 2-4 days.
TNT: 3-5 days.
EMS: 5-8 days.
Normal Post: 10-15 days.
Payment Options:
Paypal (Credit Card)
Bank Transfer (Wire Transfer)
Western Union
MoneyGram

Related products for A10097-20 Laird Technologies - Thermal Materials

Part Number Brand Description Buy

EPM2210GF324C3

Intel

IC CPLD 1700MC 7NS 324FBGA

XCR3512XL-7FTG256C

Xilinx Inc.

IC CPLD 512MC 7NSNS 256BGA

EPM2210F324C3

Intel

IC CPLD 1700MC 7NS 324FBGA

EPM7256AETC144-7

Intel

IC CPLD 256MC 7.5NS 144TQFP

XCR3384XL-12FTG256I

Xilinx Inc.

IC CPLD 384MC 10.8NS 256BGA

EPM7512AEQC208-10

Intel

IC CPLD 512MC 10NS 208QFP

EPM7512AEFC256-10

Intel

IC CPLD 512MC 10NS 256FBGA

EPM2210GF256C3N

Intel

IC CPLD 1700MC 7NS 256FBGA

XC2C384-7PQG208C

Xilinx Inc.

IC CPLD 384MC 7.1NS 208QFP

EPM7512AEQI208-10N

Intel

IC CPLD 512MC 10NS 208QFP