818-AG11SM Datasheet
Specifications for 818-AG11SM
Part Number : 818-AG11SM
Manufacturer : TE Connectivity AMP Connectors
Description : CONN IC DIP SOCKET 18POS GOLD
Series : 800
Part Status : Active
Type : DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) : 18 (2 x 9)
Pitch - Mating : 0.100" (2.54mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : -
Contact Material - Mating : Copper Alloy
Mounting Type : Surface Mount
Features : Open Frame
Termination : Solder
Pitch - Post : 0.100" (2.54mm)
Contact Finish - Post : Tin-Lead
Contact Finish Thickness - Post : -
Contact Material - Post : Copper Alloy
Housing Material : Thermoplastic, Polyester
Operating Temperature : -
Weight : -
Condition : New and original
Quality Guarantee : 365 days warranty
Stock Resource : Franchised Distributor / Manufacturer Direct
Country of Origin : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Manufacturer Part Number
Internal Part Number
AX-818-AG11SM
Manufacturer
Brief Description
CONN IC DIP SOCKET 18POS GOLD
RoHS Status
Lead free / RoHS Compliant
Delivery Time
1-2 days
Available Quantity
64165 Pieces
Reference Price
Our Price
- (Please contact us for a better price: [email protected])
- AX Semiconductor have 818-AG11SM in stock for sell. We can ship to you within 1-2 days. Please contact us for a better price for 818-AG11SM. Our email: [email protected]
- Shipping options and shipping time:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Payment Options:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
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