67SLG040040025PI00 Datasheet
Specifications for 67SLG040040025PI00
Part Number : 67SLG040040025PI00
Manufacturer : Laird Technologies EMI
Description : METAL FILM OVER FOAM CONTACTS
Series : SMD Grounding Metallized
Part Status : Active
Type : Film Over Foam
Shape : Rectangle
Width : 0.157" (4.00mm)
Length : 0.098" (2.50mm)
Height : 0.157" (4.00mm)
Material : Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Plating : -
Plating - Thickness : -
Attachment Method : Solder
Operating Temperature : -40°C ~ 70°C
Weight : -
Condition : New and original
Quality Guarantee : 365 days warranty
Stock Resource : Franchised Distributor / Manufacturer Direct
Country of Origin : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Manufacturer Part Number
Internal Part Number
Manufacturer
Brief Description
METAL FILM OVER FOAM CONTACTS
RoHS Status
Lead free / RoHS Compliant
Delivery Time
1-2 days
Available Quantity
3630485 Pieces
Reference Price
Our Price
- (Please contact us for a better price: [email protected])
- AX Semiconductor have 67SLG040040025PI00 in stock for sell. We can ship to you within 1-2 days. Please contact us for a better price for 67SLG040040025PI00. Our email: [email protected]
- Shipping options and shipping time:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Payment Options:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
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