Specifications for 573400D00000G

Part Number : 573400D00000G
Manufacturer : Aavid, Thermal Division of Boyd Corporation
Description : BOARD LEVEL HEAT SINK
Series : -
Part Status : Active
Type : Top Mount
Package Cooled : TO-268 (D³Pak)
Attachment Method : SMD Pad
Shape : Rectangular, Fins
Length : 0.500" (12.70mm)
Width : 1.220" (30.99mm)
Diameter : -
Height Off Base (Height of Fin) : 0.401" (10.20mm)
Power Dissipation @ Temperature Rise : 1.0W @ 20°C
Thermal Resistance @ Forced Air Flow : 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural : 14.00°C/W
Material : -
Material Finish : Tin
Weight : -
Condition : New and original
Quality Guarantee : 365 days warranty
Stock Resource : Franchised Distributor / Manufacturer Direct
Country of Origin : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Manufacturer Part Number
Internal Part Number
Brief Description
BOARD LEVEL HEAT SINK
RoHS Status
Lead free / RoHS Compliant
Delivery Time
1-2 days
Available Quantity
531370 Pieces
Reference Price
USD 0
Our Price
- (Please contact us for a better price: [email protected])

AX Semiconductor have 573400D00000G in stock for sell. We can ship to you within 1-2 days. Please contact us for a better price for 573400D00000G. Our email: [email protected]
Shipping options and shipping time:
DHL: 2-3 days.
FEDEX: 2-3 days.
UPS: 2-4 days.
TNT: 3-5 days.
EMS: 5-8 days.
Normal Post: 10-15 days.
Payment Options:
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Bank Transfer (Wire Transfer)
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