Specifications for 550-10-388M26-001152

Part Number : 550-10-388M26-001152
Manufacturer : Preci-Dip
Description : BGA SOLDER TAIL
Series : 550
Part Status : Active
Type : BGA
Number of Positions or Pins (Grid) : 388 (26 x 26)
Pitch - Mating : 0.050" (1.27mm)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 10.0µin (0.25µm)
Contact Material - Mating : Brass
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Pitch - Post : 0.050" (1.27mm)
Contact Finish - Post : Gold
Contact Finish Thickness - Post : 10.0µin (0.25µm)
Contact Material - Post : Brass
Housing Material : FR4 Epoxy Glass
Operating Temperature : -55°C ~ 125°C
Weight : -
Condition : New and original
Quality Guarantee : 365 days warranty
Stock Resource : Franchised Distributor / Manufacturer Direct
Country of Origin : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Manufacturer Part Number
Internal Part Number
Manufacturer
Brief Description
BGA SOLDER TAIL
RoHS Status
Lead free / RoHS Compliant
Delivery Time
1-2 days
Available Quantity
6768 Pieces
Reference Price
USD 0
Our Price
- (Please contact us for a better price: [email protected])

AX Semiconductor have 550-10-388M26-001152 in stock for sell. We can ship to you within 1-2 days. Please contact us for a better price for 550-10-388M26-001152. Our email: [email protected]
Shipping options and shipping time:
DHL: 2-3 days.
FEDEX: 2-3 days.
UPS: 2-4 days.
TNT: 3-5 days.
EMS: 5-8 days.
Normal Post: 10-15 days.
Payment Options:
Paypal (Credit Card)
Bank Transfer (Wire Transfer)
Western Union
MoneyGram

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