Specifications for 374724B00035G

Part Number : 374724B00035G
Manufacturer : Aavid, Thermal Division of Boyd Corporation
Description : HEATSINK BGA 35X35X18MM W/ADH
Series : -
Part Status : Active
Type : Top Mount
Package Cooled : BGA
Attachment Method : Thermal Tape, Adhesive (Included)
Shape : Square, Pin Fins
Length : 1.378" (35.00mm)
Width : 1.378" (35.00mm)
Diameter : -
Height Off Base (Height of Fin) : 0.709" (18.00mm)
Power Dissipation @ Temperature Rise : 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow : 5.20°C/W @ 200 LFM
Thermal Resistance @ Natural : 15.30°C/W
Material : Aluminum
Material Finish : Black Anodized
Weight : -
Condition : New and original
Quality Guarantee : 365 days warranty
Stock Resource : Franchised Distributor / Manufacturer Direct
Country of Origin : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Manufacturer Part Number
Internal Part Number
Brief Description
HEATSINK BGA 35X35X18MM W/ADH
RoHS Status
Lead free / RoHS Compliant
Delivery Time
1-2 days
Available Quantity
85480 Pieces
Reference Price
USD 0
Our Price
- (Please contact us for a better price: [email protected])

AX Semiconductor have 374724B00035G in stock for sell. We can ship to you within 1-2 days. Please contact us for a better price for 374724B00035G. Our email: [email protected]
Shipping options and shipping time:
DHL: 2-3 days.
FEDEX: 2-3 days.
UPS: 2-4 days.
TNT: 3-5 days.
EMS: 5-8 days.
Normal Post: 10-15 days.
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