335214B00000G Datasheet
Specifications for 335214B00000G
Part Number : 335214B00000G
Manufacturer : Aavid, Thermal Division of Boyd Corporation
Description : HEAT SINK
Series : *
Part Status : Active
Type : -
Package Cooled : -
Attachment Method : -
Shape : -
Length : -
Width : -
Diameter : -
Height Off Base (Height of Fin) : -
Power Dissipation @ Temperature Rise : -
Thermal Resistance @ Forced Air Flow : -
Thermal Resistance @ Natural : -
Material : -
Material Finish : -
Weight : -
Condition : New and original
Quality Guarantee : 365 days warranty
Stock Resource : Franchised Distributor / Manufacturer Direct
Country of Origin : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Manufacturer Part Number
Internal Part Number
Manufacturer
Brief Description
HEAT SINK
RoHS Status
Lead free / RoHS Compliant
Delivery Time
1-2 days
Available Quantity
366145 Pieces
Reference Price
Our Price
- (Please contact us for a better price: [email protected])
- AX Semiconductor have 335214B00000G in stock for sell. We can ship to you within 1-2 days. Please contact us for a better price for 335214B00000G. Our email: [email protected]
- Shipping options and shipping time:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Payment Options:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
Related products for 335214B00000G Aavid, Thermal Division of Boyd Corporation
| Part Number | Brand | Description | Buy |
|---|---|---|---|
| Intel | IC CPLD 1700MC 7NS 256FBGA | ||
| Xilinx Inc. | IC CPLD 512MC 10.8NS 208QFP | ||
| Xilinx Inc. | IC CPLD 512MC 10.8NS 208QFP | ||
| Microchip Technology | IC CPLD 24MC 20NS 44JLCC | ||
| Intel | IC CPLD 128MC 7.5NS 100TQFP | ||
| Xilinx Inc. | IC CPLD 384MC 7.1NS 208QFP | ||
| Xilinx Inc. | IC CPLD 512MC 10.8NS 324BGA | ||
| Intel | IC CPLD 192MC 20NS 160PGA | ||
| Intel | IC CPLD 256MC 7.5NS 208QFP | ||
| Lattice Semiconductor Corporation | IC CPLD 64MC 15NS 44TQFP |